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ADSP-BF512BBCZ-4F4 - Analog Devices

Description: Blackfin Embedded Processor

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ADSP-BF512BBCZ-4F4 - Analog Devices - PCB symbol
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PCB Footprints
ADSP-BF512BBCZ-4F4 - Analog Devices PCB footprint - BGA - BGA - 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-168-1)
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3D Models
ADSP-BF512BBCZ-4F4 - Analog Devices - 3D model - BGA - 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-168-1)
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ADSP-BF512BBCZ-4F4 Details

  • Manufacturer Part Number:

    ADSP-BF512BBCZ-4F4

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, MO-275GGAB-1, CSPBGA-168

  • Pin Count:

    168

  • Manufacturer Package Code:

    BC-168-1

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    400 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B168

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Number of Terminals:

    168

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA168,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Speed:

    400 MHz

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.164 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF512BBCZ-4F4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC first, followed by VDDDSP, and then finally VCC. This ensures that the internal voltage regulators are powered up correctly.
  • To optimize performance, consider the following: use the highest possible clock frequency, optimize code for the Blackfin processor's dual-MAC architecture, use the on-chip peripherals and DMA controllers to minimize overhead, and use the cache and scratchpad memory effectively.
  • The JTAG interface has some limitations, including a maximum clock frequency of 10 MHz, and a requirement for a specific JTAG adapter and software toolchain. Additionally, some JTAG commands may not be supported or may have limitations in certain modes.
  • To ensure reliable booting, use a high-quality external flash memory device, ensure that the flash memory is properly connected and configured, and use the boot mode pins to select the correct boot mode. Additionally, consider using a boot loader or boot ROM to simplify the boot process.
  • The ADSP-BF512BBCZ-4F4 has a maximum junction temperature of 125°C. To manage thermal performance, use a heat sink or thermal interface material, ensure good airflow, and consider using a thermal monitoring and shutdown mechanism to prevent overheating.

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ADSP-BF512BBCZ-4F4 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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