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ADSP-BF512BSWZ-4F4 - Analog Devices

Description: Blackfin Embedded Processor

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ADSP-BF512BSWZ-4F4 - Analog Devices - PCB symbol
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PCB Footprints
ADSP-BF512BSWZ-4F4 - Analog Devices PCB footprint - Quad Flat Packages - Quad Flat Packages - 176-Lead Low Profile Quad Flat Package [LQFP_EP] (SQ-176-2)
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ADSP-BF512BSWZ-4F4 - Analog Devices - 3D model - Quad Flat Packages - 176-Lead Low Profile Quad Flat Package [LQFP_EP] (SQ-176-2)
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ADSP-BF512BSWZ-4F4 Details

  • Manufacturer Part Number:

    ADSP-BF512BSWZ-4F4

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    ROHS COMPLIANT, MS-026BGAHD, LQFP-176

  • Pin Count:

    176

  • Manufacturer Package Code:

    SQ-176-2

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    400 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PQFP-G176

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP176,1.0SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Speed:

    400 MHz

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.164 V

  • Supply Voltage-Nom:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF512BSWZ-4F4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDSP. This ensures proper power-up and minimizes the risk of latch-up.
  • Optimizing performance involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache, and using the most efficient instruction set. Consult the ADSP-BF512 Software Development Kit (SDK) and the Blackfin Processor Programming Reference Manual for guidance.
  • The ADSP-BF512 has a maximum junction temperature of 125°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB. Consult the ADSP-BF512 thermal management application note for more information.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding. Additionally, ensure that the system meets the relevant EMC standards, such as FCC Part 15 or EN 301 489.
  • For harsh environments, consider the operating temperature range, humidity, and vibration. Ensure the system is designed to withstand these conditions, and consider using conformal coating, potting, or other environmental protection methods.

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ADSP-BF512BSWZ-4F4 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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