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ADSP-BF512KBCZ-3 - Analog Devices

Description: Blackfin Embedded Processor

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ADSP-BF512KBCZ-3 - Analog Devices PCB footprint - BGA - BGA - 168-Ball CSP_BGA
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ADSP-BF512KBCZ-3 - Analog Devices  - 3D model - BGA - 168-Ball CSP_BGA
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ADSP-BF512KBCZ-3 Details

  • Manufacturer Part Number:

    ADSP-BF512KBCZ-3

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    CSPBGA-168

  • Pin Count:

    168

  • Manufacturer Package Code:

    BC-168-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    300 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B168

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    168

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA168,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Speed:

    300 MHz

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.164 V

  • Supply Voltage-Nom:

    1.225 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF512KBCZ-3 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDCORE. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache, and optimizing the memory hierarchy. Analog Devices provides tools and documentation to help with this process.
  • The ADSP-BF512KBCZ-3 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking, use thermal interface materials, and follow proper PCB design guidelines to minimize thermal resistance.
  • To ensure EMC, follow proper PCB design guidelines, use shielding and filtering, and minimize noise radiation. Analog Devices provides guidelines and recommendations for EMC compliance in their documentation.
  • When using the ADSP-BF512KBCZ-3 in a harsh environment, consider the operating temperature range, humidity, and vibration. Ensure the processor is properly packaged, and follow Analog Devices' guidelines for environmental testing and qualification.

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ADSP-BF512KBCZ-3 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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