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ADSP-BF526BBCZ-3A - Analog Devices

Description: Embedded Processor

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ADSP-BF526BBCZ-3A - Analog Devices PCB footprint - Other - Other - BGA208C80P20X20_1700X1700X175
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ADSP-BF526BBCZ-3A - Analog Devices  - 3D model - Other - BGA208C80P20X20_1700X1700X175
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ADSP-BF526BBCZ-3A Details

  • Manufacturer Part Number:

    ADSP-BF526BBCZ-3A

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, MO-275MMAB-1, CSPBGA-208

  • Pin Count:

    208

  • Manufacturer Package Code:

    BC-208-2

  • Country Of Origin:

    Singapore

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA208,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Speed:

    300 MHz

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF526BBCZ-3A Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDPLL and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance involves understanding the application's requirements and configuring the processor accordingly. This includes selecting the appropriate clock frequency, configuring the cache, and optimizing the memory hierarchy. Consult the ADSP-BF526BBCZ-3A's software development kit (SDK) and application notes for guidance.
  • The ADSP-BF526BBCZ-3A has a maximum junction temperature of 125°C. Ensure proper heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB. Consult the datasheet and thermal management application notes for more information.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Consult the ADSP-BF526BBCZ-3A's EMC application notes and relevant industry standards.
  • In harsh environments, consider the processor's operating temperature range, humidity, and vibration tolerance. Ensure the system is designed to withstand these conditions, and consider using conformal coating, potting, or other environmental protection methods as needed.

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ADSP-BF526BBCZ-3A Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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