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ADSP-BF534YBCZ-4B - Analog Devices

Description: Analog Devices ADSP-BF534YBCZ-4B, 16bit Blackfin Digital Signal Processor 400MHz 132 kB Flash 208-Pin CSP BGA

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ADSP-BF534YBCZ-4B - Analog Devices - PCB symbol
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ADSP-BF534YBCZ-4B - Analog Devices PCB footprint - BGA - BGA - BC-208-2 (CSP_BGA)
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ADSP-BF534YBCZ-4B - Analog Devices - 3D model - BGA - BC-208-2 (CSP_BGA)
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ADSP-BF534YBCZ-4B Details

  • Manufacturer Part Number:

    ADSP-BF534YBCZ-4B

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    ROHS COMPLIANT, MO-205AM, CSPBGA-208

  • Pin Count:

    208

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 2.5V OR 3V SUPPLY

  • Address Bus Width:

    19

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    400 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA208,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Speed:

    400 MHz

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF534YBCZ-4B Frequently Asked Questions (FAQs)

  • Analog Devices provides a reference design guide for PCB layout and thermal management in the ADSP-BF534 Hardware Reference Manual. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Analog Devices offers a range of development tools, including the VisualDSP++ development environment and the ADSP-BF534 EZ-KIT, which provide resources and examples to help optimize the processor's performance for specific applications.
  • While the datasheet provides an overview of the peripherals, it's essential to consult the ADSP-BF534 Peripheral Reference Manual for detailed information on the limitations and constraints of each peripheral, such as baud rate limitations, clock frequency restrictions, and buffer sizes.
  • Analog Devices recommends using a secure boot mechanism, such as the one provided by the ADSP-BF534's ROM boot loader, to ensure reliable booting and firmware updates. Additionally, it's essential to follow best practices for firmware update procedures to prevent corruption or bricking of the device.
  • The ADSP-BF534 datasheet provides power consumption estimates, but for more detailed information on power management options, such as dynamic voltage and frequency scaling, it's recommended to consult the ADSP-BF534 Power Management Guide.

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ADSP-BF534YBCZ-4B Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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