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ADSP-BF547BBCZ-5A - Analog Devices

Description: Analog Devices ADSP-BF547BBCZ-5A, 16bit Blackfin Digital Signal Processor 533MHz 324 kB Flash 400-Pin CSP BGA

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ADSP-BF547BBCZ-5A - Analog Devices PCB footprint - BGA - BGA - BC-400-1
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ADSP-BF547BBCZ-5A - Analog Devices  - 3D model - BGA - BC-400-1
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ADSP-BF547BBCZ-5A Details

  • Manufacturer Part Number:

    ADSP-BF547BBCZ-5A

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    17 X 17 MM, ROHS COMPLIANT, CSBGA-400

  • Pin Count:

    400

  • Manufacturer Package Code:

    BC-400-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    22

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    50 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B400

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Speed:

    533 MHz

  • Supply Voltage-Max:

    1.43 V

  • Supply Voltage-Min:

    1.188 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF547BBCZ-5A Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDPLL simultaneously, followed by VDDRTC and VDDOSC. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance involves understanding the specific requirements of your application and configuring the processor accordingly. This may involve adjusting clock frequencies, cache settings, and memory allocation. Consult the ADSP-BF547BBCZ-5A manual and Analog Devices' application notes for guidance.
  • The ADSP-BF547BBCZ-5A has a maximum junction temperature of 125°C. Ensure proper heat sinking, airflow, and thermal interface material to maintain a safe operating temperature. Consult the datasheet and thermal management guidelines for more information.
  • Follow proper PCB design and layout guidelines, use shielding and filtering as necessary, and ensure that the system meets relevant EMC standards (e.g., FCC, CE, CISPR). Consult the ADSP-BF547BBCZ-5A manual and EMC guidelines for more information.
  • The ADSP-BF547BBCZ-5A is rated for industrial temperature range (-40°C to 85°C). For harsh environments, consider using conformal coating, potting, or hermetic sealing to protect the device. Ensure the system is designed to withstand mechanical stress, vibration, and humidity.

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ADSP-BF547BBCZ-5A Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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