ADSP-BF606BBCZ-4 - Analog Devices

ADSP-BF606BBCZ-4 Details

• Manufacturer Part Number:

  ADSP-BF606BBCZ-4

• Brand Name:

  Analog Devices Inc

• Pbfree Code:

  No

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  CSBGA-349

• Pin Count:

  349

• Manufacturer Package Code:

  BC-349-1

• Country Of Origin:

  South Korea

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  Analog Devices Inc

• YTEOL:

  10

• Address Bus Width:

  25

• Barrel Shifter:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  60 MHz

• External Data Bus Width:

  16

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PBGA-B349

• JESD-609 Code:

  e1

• Length:

  19 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of External Interrupts:

  6

• Number of Serial I/Os:

  3

• Number of Terminals:

  349

• Number of Timers:

  8

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA349,22X22,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (words):

  282624

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.5 mm

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.19 V

• Supply Voltage-Nom:

  1.25 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  19 mm

• uPs/uCs/Peripheral ICs Type:

  DIGITAL SIGNAL PROCESSOR, MIXED