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ADSP-BF707KBCZ-4 - Analog Devices

Description: Digital Signal Processors & Controllers - DSP, DSC Low Cost sngl core BF+w/Large int l mem

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PCB Footprints
ADSP-BF707KBCZ-4 - Analog Devices PCB footprint - BGA - BGA - (BC-184-1)
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ADSP-BF707KBCZ-4 - Analog Devices  - 3D model - BGA - (BC-184-1)
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ADSP-BF707KBCZ-4 Details

  • Manufacturer Part Number:

    ADSP-BF707KBCZ-4

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-184

  • Pin Count:

    184

  • Manufacturer Package Code:

    BC-184-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Address Bus Width:

    14

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    60 MHz

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B184

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    184

  • Number of Timers:

    8

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA184,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

ADSP-BF707KBCZ-4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDDINT and VDDRTC simultaneously, followed by VDDDSP and VDDIO. This ensures proper power-up and minimizes the risk of latch-up or other damage.
  • Optimizing performance requires understanding the application's requirements and configuring the processor accordingly. This includes selecting the optimal clock frequency, configuring the cache and memory, and optimizing the code for the specific use case.
  • The ADSP-BF707KBCZ-4 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking, ensure good airflow, and avoid overheating. A thermal design guide is available from Analog Devices to help with thermal management.
  • To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using shielding and filtering as needed. Additionally, ensure that the system meets the relevant EMC standards and regulations.
  • When using the ADSP-BF707KBCZ-4 in a harsh environment, consider the operating temperature range, humidity, and vibration. Ensure the system is designed to withstand these conditions, and consider using conformal coating, potting, or other environmental protection methods as needed.

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ADSP-BF707KBCZ-4 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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