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ADSP-SC598KBPZ10 - Analog Devices

Description: Up to 1 GHz Dual-SHARC+ DSP w/ Integrated Arm® Cortex®-A55

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ADSP-SC598KBPZ10 - Analog Devices PCB footprint - BGA - BGA - BP-400-3
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ADSP-SC598KBPZ10 - Analog Devices  - 3D model - BGA - BP-400-3
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ADSP-SC598KBPZ10 Details

  • Manufacturer Part Number:

    ADSP-SC598KBPZ10

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-400

  • Pin Count:

    400

  • Manufacturer Package Code:

    BP-400-3

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Address Bus Width:

    16

  • Barrel Shifter:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    30 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B400

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    6

  • Number of Terminals:

    400

  • Number of Timers:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • RAM (words):

    3407872

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, MIXED

ADSP-SC598KBPZ10 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to power up the core voltage (VDD_INT) first, followed by the I/O voltage (VDD_IO), and then the analog voltage (VDD_ADC). This sequence helps to prevent damage to the device.
  • To optimize performance, consider factors such as clock frequency, cache usage, and memory access patterns. The ADSP-SC598 has a variety of performance optimization features, including a cache-based architecture, DMA controllers, and a flexible memory interface. Consult the ADSP-SC598 Software Development Kit (SDK) and the Analog Devices support team for guidance on optimizing performance for your specific application.
  • The ADSP-SC598 has an industrial temperature range of -40°C to +85°C, and an extended temperature range of -55°C to +125°C. However, the device's performance and reliability may be affected at extreme temperatures. Consult the datasheet and the Analog Devices support team for more information on temperature-related considerations.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering as necessary, and consider the device's electromagnetic radiation characteristics. Consult the ADSP-SC598 datasheet and the Analog Devices support team for more information on EMC considerations.
  • The ADSP-SC598 has a variety of debugging and testing features, including JTAG and serial wire debug interfaces, as well as built-in self-test (BIST) capabilities. Consult the ADSP-SC598 datasheet and the Analog Devices support team for more information on debugging and testing methods.

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ADSP-SC598KBPZ10 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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