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ADT7460ARQZ-REEL - onsemi

Description: Fan Control, Temp Monitor -40°C ~ 120°C, External Sensor Internal and External Sensor SMBus Output 16-QSOP

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ADT7460ARQZ-REEL - onsemi - PCB symbol
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PCB Footprints
ADT7460ARQZ-REEL - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - QSOP16 CASE 492−01 ISSUE A-1
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ADT7460ARQZ-REEL - onsemi - 3D model - Small Outline Packages - QSOP16 CASE 492−01 ISSUE A-1
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ADT7460ARQZ-REEL Details

  • Manufacturer Part Number:

    ADT7460ARQZ-REEL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    QSOP-16

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    492-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    120 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Current-Max (Isup):

    3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.64 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

ADT7460ARQZ-REEL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the thermal path as short as possible.
  • Calibration involves trimming the temperature sensor's offset and gain using the OTP (One-Time Programmable) memory. The calibration process typically involves measuring the device's temperature reading at multiple points and adjusting the offset and gain accordingly.
  • The maximum allowed thermal resistance between the device and the heat sink depends on the specific application and the desired thermal performance. As a general guideline, a thermal resistance of less than 10°C/W is recommended for optimal performance.
  • Yes, the ADT7460ARQZ-REEL is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • The recommended power-up sequence involves applying the power supply voltage (VCC) before the input voltage (VIN). This ensures that the internal voltage regulators are properly enabled and that the device powers up correctly.

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ADT7460ARQZ-REEL Overview

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