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ADUCM3027BCPZ-R7 - Analog Devices

Description: Ultra Low Power ARM Cortex-M3 MCU with Integrated Power Management and 128 KB of Embedded Flash Memory 1.74 V to 3.6 V −0.7 to +1.15

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PCB Footprints
ADUCM3027BCPZ-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-64-16
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3D Models
ADUCM3027BCPZ-R7 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-64-16
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ADUCM3027BCPZ-R7 Details

  • Manufacturer Part Number:

    ADUCM3027BCPZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    CP-64-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    2016-02-18

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Has ADC:

    YES

  • Bit Size:

    32

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-XQCC-N64

  • JESD-609 Code:

    e3

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    44

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    65536

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    0.8 mm

  • Speed:

    26 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.74 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

ADUCM3027BCPZ-R7 Frequently Asked Questions (FAQs)

  • Analog Devices provides a recommended PCB layout guide for the ADUCM3027BCPZ-R7 in the device's evaluation board documentation. It's essential to follow this guide to ensure proper thermal management, noise reduction, and signal integrity.
  • To optimize power consumption, use the device's power modes (e.g., idle, sleep, and shutdown) and adjust the clock frequency according to your application's requirements. Additionally, consider using a low-power oscillator and optimizing the analog-to-digital converter (ADC) sampling rate.
  • The ADUCM3027BCPZ-R7 is rated for operation up to 125°C ambient temperature. However, it's essential to consider the device's thermal management and ensure proper heat dissipation to maintain reliability and performance.
  • The ADUCM3027BCPZ-R7 is not certified for safety-critical applications. If you need a safety-certified device, consider using a different part from Analog Devices or another manufacturer that meets the required safety standards (e.g., IEC 61508, ISO 26262, or FDA 510(k)).
  • To ensure EMC, follow proper PCB design and layout practices, use shielding and filtering techniques, and consider using a metal shield or enclosure for the device. Additionally, perform EMC testing and certification according to relevant standards (e.g., IEC 61000-4-x or CISPR 11).

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ADUCM3027BCPZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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