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ADUM131D1BRZ-RL7 - Analog Devices

Description: Robust, Triple Ch. isolator W/ Input Disable & 1 Reverse Channel

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ADUM131D1BRZ-RL7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-16 (SOIC)
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ADUM131D1BRZ-RL7 - Analog Devices  - 3D model - Small Outline Packages - R-16 (SOIC)
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ADUM131D1BRZ-RL7 Details

  • Manufacturer Part Number:

    ADUM131D1BRZ-RL7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    R-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8543.70.98.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    ALSO OPERATES AT 2.5V, 3.3V, 5V NOMINAL SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

ADUM131D1BRZ-RL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADUM131D1BRZ-RL7 should minimize the distance between the input and output pins, use a solid ground plane, and avoid routing high-frequency signals near the isolation barrier. Additionally, it's recommended to use a symmetrical layout to minimize electromagnetic interference (EMI).
  • To ensure reliable operation of the ADUM131D1BRZ-RL7 in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding thermal gradients. Additionally, the device should be operated within its specified temperature range (-40°C to 125°C).
  • The ADUM131D1BRZ-RL7 is capable of supporting data rates up to 150 Mbps, making it suitable for high-speed digital isolation applications. However, the actual data rate may vary depending on the specific application, PCB layout, and signal quality.
  • To troubleshoot issues with the ADUM131D1BRZ-RL7, start by verifying the power supply and input signal integrity. Check for proper termination, signal amplitude, and frequency. Use an oscilloscope to monitor the input and output signals, and look for signs of signal degradation or distortion. If issues persist, consult the datasheet and application notes for guidance on troubleshooting and debugging.
  • Yes, the ADUM131D1BRZ-RL7 is compatible with various industrial communication protocols, including PROFIBUS, DeviceNet, and others. Its high-speed digital isolation capabilities make it suitable for use in industrial automation and control systems.

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ADUM131D1BRZ-RL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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