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ADXRS623BBGZ - Analog Devices

Description: ANALOG DEVICES - ADXRS623BBGZ - GYROSCOPE, MEMS, YAW, +/-150DPS, 32BGA

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ADXRS623BBGZ - Analog Devices - PCB symbol
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ADXRS623BBGZ - Analog Devices PCB footprint - BGA - BGA - ADXRS623
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ADXRS623BBGZ - Analog Devices - 3D model - BGA - ADXRS623
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ADXRS623BBGZ Details

  • Manufacturer Part Number:

    ADXRS623BBGZ

  • Source Url Status Check Date:

    2013-05-01 14:56:52.367

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    BGA-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    BG-32-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    7A994

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-CBGA-B32

  • Length:

    6.85 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA32,7X7,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.8 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    6.85 mm

ADXRS623BBGZ Frequently Asked Questions (FAQs)

  • The recommended PCB layout and placement for the ADXRS623BBGZ involves keeping the device away from high-current carrying traces, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • The ADXRS623BBGZ does not require calibration in the classical sense. However, it is recommended to perform a zero-rate offset calibration to account for any bias in the sensor. This can be done by taking the average of the sensor output over a period of time when the device is at rest.
  • The ADXRS623BBGZ is sensitive to temperature changes, which can affect its sensitivity and offset. The device is specified to operate over a temperature range of -40°C to 125°C, and the user should consider temperature compensation or calibration to ensure accurate measurements.
  • The ADXRS623BBGZ output can be filtered using a low-pass filter to reduce noise and aliasing. A 2nd-order Butterworth filter with a cutoff frequency of around 100 Hz is recommended. Digital filtering techniques can also be used, such as a moving average filter or a Kalman filter.
  • The power-on sequence for the ADXRS623BBGZ involves applying power to the device in the following order: VDD, VIO, and then CLKIN. The device requires a power-on reset (POR) circuit to ensure proper initialization.

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ADXRS623BBGZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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