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AFT05MS003NT1 - NXP

Description: NXP - AFT05MS003NT1 - TRANSISTOR, RF, 30V, SOT-89-3

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Symbol
AFT05MS003NT1 - NXP - PCB symbol
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PCB Footprints
AFT05MS003NT1 - NXP PCB footprint - Other - Other - SOT-89
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3D Models
AFT05MS003NT1 - NXP - 3D model - Other - SOT-89
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AFT05MS003NT1 Details

  • Manufacturer Part Number:

    AFT05MS003NT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-89A, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    ESD PROTECTED

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    30 V

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    1.1 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PSSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

AFT05MS003NT1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and consider derating the device's power handling capabilities according to the temperature range.
  • The recommended soldering conditions for AFT05MS003NT1 include a peak temperature of 260°C, with a soldering time of 10-30 seconds. For rework, it's recommended to use a low-temperature soldering iron and a solder with a melting point below 200°C.
  • To prevent ESD damage, it's essential to handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper grounding procedures during assembly. It's also recommended to use an ESD-protected workstation and to ground yourself before handling the device.
  • The AFT05MS003NT1 is a moisture-sensitive device, and exposure to high humidity or moisture can affect its reliability. It's essential to follow proper storage and handling procedures, including using moisture-barrier bags and desiccants, to minimize the risk of moisture-related damage.

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AFT05MS003NT1 Overview

Use the download button to access the AFT05MS003NT1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AFT05, or try a keyword search, such as RF Power Field-Effect Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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