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AFT27S012NT1 - NXP

Description: AIRFAST RF POWER LDMOS TRANSISTO

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AFT27S012NT1 - NXP PCB footprint - Other - Other - AFT27S012NT1-3
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AFT27S012NT1 - NXP  - 3D model - Other - AFT27S012NT1-3
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AFT27S012NT1 Details

  • Manufacturer Part Number:

    AFT27S012NT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    65 V

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Highest Frequency Band:

    S BAND

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Gain-Min (Gp):

    20 dB

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

AFT27S012NT1 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The AFT27S012NT1 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if operating at high temperatures or high power levels.
  • While the datasheet specifies a maximum operating frequency of 2.7 GHz, NXP recommends operating the device up to 2.5 GHz for optimal performance and to ensure compliance with regulatory requirements.
  • NXP provides a set of recommended operating conditions and biasing schemes in the application note AN11542. Additionally, the device's gain and linearity can be optimized by adjusting the VCC and VBIAS voltages, as well as the input and output matching networks.
  • The AFT27S012NT1 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. NXP recommends using anti-static packaging, wrist straps, and mats, and handling the devices in a controlled environment with humidity below 60%.

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AFT27S012NT1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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