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- Part Number AG203-63G
- Manufacturer Qorvo
- Pin Count 6
- Part Category Integrated Circuit
- Package Category SOT23 (6-Pin)
- Footprint Name SOT23 (6-Pin) - SOT23-6
- Released Date Nov 16, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
AG203-63G Details
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Manufacturer Part Number:
AG203-63G
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SOT-363, 6 PIN
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Country Of Origin:
Malaysia
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ECCN Code:
5A991.B
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Manufacturer:
Qorvo
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YTEOL:
6.83
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Additional Feature:
HIGH RELIABILITY
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Characteristic Impedance:
50 Ω
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Construction:
COMPONENT
AG203-63G Frequently Asked Questions (FAQs)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use a thermal pad or heat sink for high-power applications.
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Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a 50-ohm system impedance and ensure a good return loss (>10 dB) for maximum gain and efficiency.
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Operate the device within the recommended temperature range (-40°C to 85°C) and avoid exceeding the maximum junction temperature (150°C). Ensure a stable power supply and avoid electrical overstress.
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Use a shielded enclosure, ensure good PCB layout and grounding, and consider adding EMI filters or absorbers. Follow FCC and CE regulations for EMC compliance.
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The AG203-63G is suitable for wireless infrastructure, small cells, and 5G massive MIMO applications. It can also be used in radar, satellite communications, and other high-frequency systems.
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AG203-63G Overview
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About Qorvo
Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.