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AGN21012 - Panasonic

Description: Low Signal Relays - PCB 1A 12VDC DPDT LATCHING PCB

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PCB Footprints
AGN21012 - Panasonic PCB footprint - Other - Other - AGN21012-3
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3D Models
AGN21012 - Panasonic  - 3D model - Other - AGN21012-3
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AGN21012 Details

  • Manufacturer Part Number:

    AGN21012

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7.87

  • Additional Feature:

    RELEASE TIME WITH DIODE

  • Body Breadth:

    5.7 mm

  • Body Height:

    9 mm

  • Body Length or Diameter:

    10.6 mm

  • Coil Current(DC)-Max:

    0.008 A

  • Coil Operate Voltage(DC):

    9 V

  • Coil Power:

    100 mW

  • Coil Release Voltage(DC):

    9 V

  • Coil Resistance:

    1440 Ω

  • Coil Voltage(DC)-Max:

    12 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Rating R Load:

    1A@125VAC

  • Contact Current(AC)-Max:

    1 A

  • Contact Current(DC)-Max:

    1 A

  • Contact (DC) Max Rating R Load:

    1A@110VDC

  • Contact Voltage(AC)-Max:

    125 V

  • Contact Voltage(DC)-Max:

    110 V

  • Contact/Output Supply Type:

    AC/DC

  • Electrical Life:

    100000 Cycle(s)

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Operate Time:

    4 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BOX; TUBE

  • Physical Dimension:

    10.6mm x 5.7mm x 9mm

  • Reference Standard:

    BSI; CSA; UL

  • Relay Action:

    LATCHED

  • Relay Function:

    DPDT

  • Relay Type:

    POWER/SIGNAL RELAY

  • Release Time:

    4 ms

  • Sealing:

    WATER PROOF

  • Surface Mount:

    NO

  • Termination Type:

    SOLDER

AGN21012 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and symmetrical, and use a common mode choke to reduce EMI.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Use thermal management techniques, such as heat sinks or thermal pads, to keep the junction temperature below 150°C.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input capacitor. This value provides a good balance between noise filtering and stability.
  • Use a shielded enclosure, keep the PCB layout compact, and use EMI filters or common mode chokes on the input and output lines. Also, ensure the device is properly grounded and use a low-ESR output capacitor.
  • The maximum allowed voltage drop is 1.5V. Exceeding this value may cause the device to malfunction or reduce its lifespan.

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AGN21012 Overview

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