AIAC-1812-R12J-T footprint, schematic symbol and 3D model by ABRACON

Symbol

PCB Footprints

3D Models

AIAC-1812-R12J-T Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
To prevent moisture-related issues, Abracon recommends storing the components in a dry environment (less than 20% RH) and following the recommended baking procedure before reflow soldering. Additionally, ensure that the PCB is properly cleaned and dried before assembly.
The maximum reflow temperature for the AIAC-1812-R12J-T is 260°C, with a peak temperature not exceeding 240°C for more than 20 seconds. Exceeding this temperature may cause damage to the component.
While the AIAC-1812-R12J-T is designed to be robust, it's essential to ensure that the PCB is properly secured and the component is adequately supported to prevent mechanical stress. Abracon recommends following the recommended mounting and soldering procedures to minimize the risk of component failure in high-vibration environments.
Abracon recommends using a reflow soldering process with a peak temperature of 240°C and a dwell time of 20-30 seconds. The soldering process should be performed in a nitrogen atmosphere to minimize oxidation and ensure reliable joints.

Manufacturer Collaborated

System Verified

Community Approved

Use the download button to access the AIAC-1812-R12J-T schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like AIAC-, or try a keyword search, such as Fixed Inductors

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →