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AIAP-02-330K - ABRACON

Description: 220µH Unshielded Wirewound Inductor 1.89A 162mOhm Max Axial

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Symbol
AIAP-02-330K - ABRACON - PCB symbol
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PCB Footprints
AIAP-02-330K - ABRACON PCB footprint - Inductors, Axial Diameter Horizontal Mounting - Inductors, Axial Diameter Horizontal Mounting - AIAP-02-6
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3D Models
AIAP-02-330K - ABRACON - 3D model - Inductors, Axial Diameter Horizontal Mounting - AIAP-02-6
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AIAP-02-330K Details

  • Manufacturer Part Number:

    AIAP-02-330K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7

  • DC Resistance:

    0.076 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Lead Diameter:

    0.8 mm

  • Lead Length:

    29.2 mm

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Diameter:

    6.8 mm

  • Package Length:

    14 mm

  • Package Style:

    Axial

  • Packing Method:

    Tray

  • Rated Current-Max:

    2.2 A

  • Shape/Size Description:

    TUBULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    NO

  • Terminal Placement:

    AXIAL

  • Terminal Shape:

    WIRE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

AIAP-02-330K Frequently Asked Questions (FAQs)

  • Abracon recommends following the IPC-7351B standard for PCB land pattern and layout. A minimum of 2mm clearance around the component is recommended to ensure proper heat dissipation and to prevent electrical noise.
  • The AIAP-02-330K is designed to operate in high-frequency environments and has built-in EMI shielding. However, it's still recommended to follow proper PCB design and layout practices to minimize noise and EMI effects.
  • The AIAP-02-330K is rated for operation from -40°C to +85°C. However, it's recommended to derate the component's performance at temperatures above 70°C to ensure long-term reliability.
  • The AIAP-02-330K is designed to meet the requirements of MIL-STD-202G, Method 204D, Condition A for vibration and shock. However, it's recommended to perform additional testing and validation for specific application requirements.
  • Abracon recommends following the IPC-J-STD-020D.1 standard for soldering profiles. A peak temperature of 260°C and a dwell time of 30-60 seconds is recommended for optimal solder joint reliability.

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AIAP-02-330K Overview

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