AIML-1206-8R2K-T footprint, schematic symbol and 3D model by ABRACON

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AIML-1206-8R2K-T Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape, and a minimum clearance of 0.2mm between the pad and the solder mask.
Yes, the AIML-1206-8R2K-T is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the recommended specifications.
Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp rate of 3°C/second. It's essential to follow the recommended soldering profile to ensure reliable assembly and to prevent damage to the component.
Yes, the AIML-1206-8R2K-T is compatible with lead-free soldering processes and is RoHS compliant. However, it's essential to ensure that the soldering process is optimized for lead-free soldering to prevent defects and ensure reliable assembly.
The typical power dissipation of the AIML-1206-8R2K-T is 250mW. However, the actual power dissipation may vary depending on the operating conditions and the specific application. It's essential to ensure that the component is properly derated and that the operating conditions do not exceed the recommended specifications.

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