The recommended land pattern for the AISC-0402-5N1G-T is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.1mm from the component body.
During reflow soldering, the AISC-0402-5N1G-T should be exposed to a peak temperature of 260°C for a maximum of 10 seconds. The component should be placed on a solder paste layer with a thickness of 0.1mm to 0.2mm, and the reflow profile should follow the JEDEC J-STD-020D standard.
Yes, the AISC-0402-5N1G-T is compatible with lead-free soldering. The component is RoHS-compliant and can withstand the higher temperatures required for lead-free soldering processes.
The maximum operating temperature range for the AISC-0402-5N1G-T is -40°C to +125°C. However, the component's performance may degrade at temperatures above 85°C, and it is recommended to derate the component's specifications accordingly.
The AISC-0402-5N1G-T should be stored in a dry, cool place with a relative humidity of 50% or less. The component should be stored in its original packaging or in a moisture-proof bag with a desiccant packet to prevent moisture absorption.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
AISC-0402-5N1G-T Overview
Use the download button to access the AISC-0402-5N1G-T schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like AISC-,
or try a keyword search, such as Fixed Inductors
