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AISC-0603HP-3N3B-T - ABRACON

Description: Inductor RF Chip Wirewound 3.3nH 0.2nH 250MHz 35Q-Factor Ceramic 1.7A 35mOhm DCR 0603 T/R

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AISC-0603HP-3N3B-T - ABRACON PCB footprint - Other - Other - AISC-0603HP
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AISC-0603HP-3N3B-T Details

  • Manufacturer Part Number:

    AISC-0603HP-3N3B-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7.8

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.035 Ω

  • Inductance-Nom (L):

    0.0033 µH

  • Inductor Application:

    HIGH CURRENT INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.02 mm

  • Package Length:

    1.8 mm

  • Package Style:

    SMT

  • Package Width:

    1.12 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    35

  • Rated Current-Max:

    1.7 A

  • Self Resonance Frequency:

    6900 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    250 MHz

  • Tolerance:

    6.07%

AISC-0603HP-3N3B-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the AISC-0603HP-3N3B-T is a rectangular pad with a size of 0.65mm x 0.35mm, with a non-solder mask defined (NSMD) pad shape.
  • To minimize the impact of vibration and shock on the crystal resonator, it is recommended to use a shock-absorbing material, such as a silicone adhesive, to mount the device. Additionally, the PCB should be designed to minimize mechanical stress on the device.
  • The recommended storage condition for the AISC-0603HP-3N3B-T is in a dry, cool place, away from direct sunlight, with a temperature range of -20°C to 40°C and humidity below 60%.
  • The AISC-0603HP-3N3B-T is rated for operation up to 85°C, but it can be used in high-temperature environments with some derating. However, it is recommended to consult with Abracon Corporation's application engineers for specific guidance on high-temperature applications.
  • To ensure proper soldering, it is recommended to use a soldering iron with a temperature of 250°C to 260°C, and to apply a small amount of solder paste to the pads. The device should be soldered within 3 seconds to prevent overheating.

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AISC-0603HP-3N3B-T Overview

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