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AISC-0805F-100G-T - ABRACON

Description: 10 µH Unshielded Drum Core, Wirewound Inductor 98 mA 4.7Ohm Max 0805 (2012 Metric)

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AISC-0805F-100G-T - ABRACON - PCB symbol
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PCB Footprints
AISC-0805F-100G-T - ABRACON PCB footprint - Other - Other - AISC-0805F
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AISC-0805F-100G-T Details

  • Manufacturer Part Number:

    AISC-0805F-100G-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, 0805

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    5.5

  • Case/Size Code:

    0805

  • Core Material:

    CERAMIC

  • DC Resistance:

    4.7 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.098 A

  • Self Resonance Frequency:

    30 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    Q MEASURED AT 2.5 MHZ

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2.5 MHz

  • Tolerance:

    2%

AISC-0805F-100G-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the AISC-0805F-100G-T is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.1mm from the component body.
  • The AISC-0805F-100G-T is rated for operation up to 125°C, but it's recommended to derate the component's performance at higher temperatures. For applications above 125°C, Abracon recommends using a different component or consulting with their application engineers for guidance.
  • The maximum reflow temperature for the AISC-0805F-100G-T is 260°C, with a maximum time above 220°C of 30 seconds. Exceeding this temperature or time may damage the component or affect its reliability.
  • Yes, the AISC-0805F-100G-T is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's recommended to follow the manufacturer's recommended soldering profile and guidelines to ensure reliable assembly.
  • The typical tolerance for the inductance value of the AISC-0805F-100G-T is ±10%. This means that the actual inductance value may vary by up to 10% from the nominal value specified in the datasheet.

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AISC-0805F-100G-T Overview

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