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AISC-0805F-330J-T - ABRACON

Description: 33 µH Unshielded Drum Core, Wirewound Inductor 60 mA 10.7Ohm Max 0805 (2012 Metric)

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AISC-0805F-330J-T - ABRACON - PCB symbol
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AISC-0805F-330J-T - ABRACON PCB footprint - Other - Other - AISC-0805F
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AISC-0805F-330J-T Details

  • Manufacturer Part Number:

    AISC-0805F-330J-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    5.5

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    10.7 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.55 mm

  • Package Length:

    2.29 mm

  • Package Style:

    SMT

  • Package Width:

    1.73 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.06 A

  • Self Resonance Frequency:

    17 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    Q IS MEASURED AT: 2.5MHZ

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    2.5 MHz

  • Tolerance:

    5%

AISC-0805F-330J-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the AISC-0805F-330J-T is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the AISC-0805F-330J-T is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process should be optimized to prevent thermal damage.
  • The AISC-0805F-330J-T is designed to withstand moderate levels of vibration and mechanical stress. However, it's crucial to ensure that the component is properly mounted and secured to the PCB to prevent damage or detachment. Abracon recommends following the recommended mounting and handling procedures to minimize the risk of mechanical failure.
  • Yes, the AISC-0805F-330J-T is compatible with lead-free soldering processes. Abracon recommends using a soldering temperature profile that follows the IPC-J-STD-020D standard to ensure reliable solder joints.
  • The typical tolerance for the inductance value of the AISC-0805F-330J-T is ±10%. This means that the actual inductance value may vary by up to 10% from the nominal value specified in the datasheet.

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AISC-0805F-330J-T Overview

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