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AISM-1210-3R9K-T - ABRACON

Description: Inductor RF Molded Wirewound 3.9uH 10% 7.96MHz 30Q-Factor 0.25A 1.3Ohm DCR 1210 T/R

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AISM-1210-3R9K-T - ABRACON - PCB symbol
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AISM-1210-3R9K-T - ABRACON PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - AISM-1210-3R9K-T
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AISM-1210-3R9K-T Details

  • Manufacturer Part Number:

    AISM-1210-3R9K-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, 1210, ROHS COMPLIANT

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    1210

  • Construction:

    Molded Chip

  • DC Resistance:

    1.3 Ω

  • Inductance-Nom (L):

    3.9 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.54 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.2 mm

  • Packing Method:

    TR

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.25 A

  • Self Resonance Frequency:

    55 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    J BEND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    10%

AISM-1210-3R9K-T Frequently Asked Questions (FAQs)

  • Abracon provides a recommended PCB layout and land pattern in their application note AN-03, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and minimize parasitic effects.
  • The AISM-1210-3R9K-T has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow the thermal management guidelines in the datasheet and application notes.
  • Abracon recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The soldering process should be done in a nitrogen atmosphere to minimize oxidation. Refer to the datasheet and application notes for more detailed information.
  • The AISM-1210-3R9K-T is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to use additional mechanical support, such as a bracket or a clamp, to ensure the device remains securely attached to the PCB. Consult with Abracon's technical support for specific guidance.
  • Start by reviewing the datasheet and application notes to ensure proper usage and configuration. Check the PCB layout and assembly for any errors or defects. Use oscilloscopes and other diagnostic tools to identify the issue. If the problem persists, contact Abracon's technical support for further assistance.

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AISM-1210-3R9K-T Overview

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