ALDP112 footprint, schematic symbol and 3D model by Panasonic

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ALDP112 - Panasonic PCB footprint - Other - Other - LD-P

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3D Models

ALDP112 - Panasonic - 3D model - Other - LD-P

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Datasheet Download Datasheet
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Part Number ALDP112
Manufacturer Panasonic
Pin Count 4
Part Category Relay or Contactor
Package Category Other
Footprint Name Other - LD-P
Released Date Sep 25, 2017
Last Modified Date Mar 27, 2026 6:38 PM UTC
Pinout / Pin List Click Here (Member Only)

ALDP112 Details

Manufacturer Part Number:
ALDP112
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Manufacturer:
Panasonic Electronic Components
Additional Feature:
WITH DIODE
Body Breadth:
7.2 mm
Body Height:
15.3 mm
Body Length or Diameter:
20.5 mm
Coil Current(DC)-Max:
0.0167 A
Coil Operate Voltage(DC):
9 V
Coil Power:
200 mW
Coil Release Voltage(DC):
0.6 V
Coil Resistance:
720 Ω
Coil Voltage(DC)-Max:
15.6 V
Coil Voltage-Nom:
12 V
Coil/Input Supply Type:
DC
Contact (AC) Max Power Rating R Load:
1385VA@277VAC
Contact (AC) Max Rating R Load:
5A@277VAC
Contact Current(AC)-Max:
5 A
Contact Resistance:
100 mΩ
Contact Voltage(AC)-Max:
277 V
Contact/Output Supply Type:
AC
Electrical Life:
200000 Cycle(s)
End Contact Material:
Silver Nickel
Input Switching Control Type:
Random
Insulation Resistance:
1000000000 Ω
Mounting Feature:
THROUGH HOLE-STRAIGHT
Number of Terminals:
4
Operate Time:
10 ms
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Packing Method:
TUBE
Physical Dimension:
20.5mm x 7.2mm x 15.3mm
Reference Standard:
UL; VDE
Relay Action:
MOMENTARY
Relay Form:
1 FORM A
Relay Function:
SPST
Relay Type:
POWER/SIGNAL RELAY
Release Time:
10 ms
Surface Mount:
NO
Terminal Length:
0.0034010668021336042 inch
Termination Type:
SOLDER

ALDP112 Frequently Asked Questions (FAQs)

A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
Monitor the input voltage, output current, and ambient temperature to ensure they are within the recommended ranges. Use thermal management techniques, such as heat sinks or thermal interfaces, to keep the junction temperature below 125°C.
Exceeding the maximum ratings can lead to reduced lifespan, decreased performance, or even permanent damage to the device. Ensure that the device operates within the recommended specifications to maintain reliability and performance.
Check the input voltage, output current, and ambient temperature. Verify that the PCB layout and thermal management are adequate. Use oscilloscopes or other diagnostic tools to identify the root cause of the issue and take corrective action.
Yes, but ensure that the device is used within its recommended specifications and that the system is designed with adequate redundancy, fault tolerance, and fail-safes to mitigate potential failures.

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