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ALS31300EEJASR-500 - Allegro Microsystems

Description: 3-Axis Linear Hall W/I2C Output

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PCB Footprints
ALS31300EEJASR-500 - Allegro Microsystems PCB footprint - Other - Other - EJ,10-Pin DFN with Exposed Thermal Pad and Wettable Flank
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3D Models
ALS31300EEJASR-500 - Allegro Microsystems  - 3D model - Other - EJ,10-Pin DFN with Exposed Thermal Pad and Wettable Flank
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ALS31300EEJASR-500 Details

  • Manufacturer Part Number:

    ALS31300EEJASR-500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-10

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    7.03

  • Body Breadth:

    3 mm

  • Body Height:

    0.725 mm

  • Body Length or Diameter:

    3 mm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    2-WIRE INTERFACE

  • Output Type:

    DIGITAL VOLTAGE

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    MAGNETIC FIELD SENSOR,HALL EFFECT

  • Supply Voltage-Max:

    3.5 V

  • Supply Voltage-Min:

    2.65 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Termination Type:

    SOLDER

ALS31300EEJASR-500 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a ferrite bead or a 10uF capacitor to filter the power supply.
  • Ensure proper PCB layout, use a stable power supply, and minimize noise coupling. Use a low-pass filter to remove high-frequency noise. Calibrate the device according to the datasheet and application note guidelines.
  • The ALS31300EEJASR-500 can operate from -40°C to 150°C. However, the device's accuracy and performance may degrade at extreme temperatures. Ensure proper thermal management and heat sinking to maintain optimal performance.
  • Yes, the ALS31300EEJASR-500 is designed to withstand high vibrations. However, ensure proper mounting and mechanical fixation to prevent damage. Follow the recommended PCB layout and component placement to minimize vibration-induced noise.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check the power supply, PCB layout, and component placement. Use an oscilloscope to analyze the output signals and identify noise sources. Consult Allegro MicroSystems' technical support if issues persist.

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ALS31300EEJASR-500 Overview

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