AMDLA4530S-2R2MT footprint, schematic symbol and 3D model by ABRACON

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AMDLA4530S-2R2MT Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
Yes, the AMDLA4530S-2R2MT is rated for operation up to 125°C, making it suitable for high-temperature applications. However, derating may be necessary for extended operation at high temperatures.
Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp rate of 3°C/second to minimize thermal stress and ensure reliable solder joints.
Yes, the AMDLA4530S-2R2MT is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
The typical power dissipation of the AMDLA4530S-2R2MT is around 1.5W, but this can vary depending on the specific application and operating conditions.

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