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AMIS30600LINI1G - onsemi

Description: ON Semiconductor AMIS30600LINI1G, LIN Transceiver 20kBd 1-Channel ISO 9141, 8-Pin SOIC

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AMIS30600LINI1G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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AMIS30600LINI1G - onsemi  - 3D model - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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AMIS30600LINI1G Details

  • Manufacturer Part Number:

    AMIS30600LINI1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751AZ

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9276 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7272 mm

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.937 mm

AMIS30600LINI1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMIS30600LINI1G involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the load. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the stability of the output voltage, it's essential to use a suitable output capacitor with a low ESR (Equivalent Series Resistance) and a high ripple current rating. The output capacitor should be placed as close as possible to the device, and the PCB layout should be designed to minimize the inductance of the output traces.
  • The maximum allowed input voltage ripple for the AMIS30600LINI1G is 10% of the input voltage. Exceeding this limit may affect the device's performance and stability.
  • The AMIS30600LINI1G is rated for operation up to 125°C, but it's essential to ensure that the device is properly derated for high-temperature operation. The device's power dissipation should be limited to avoid overheating, and the PCB layout should be designed to ensure good thermal dissipation.
  • To troubleshoot issues with the AMIS30600LINI1G, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly configured and that the PCB layout is correct. Use an oscilloscope to check for noise and ripple on the input and output voltages. If the issue persists, consult the datasheet and application notes for guidance.

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Part Image AMIS30600LINI1RG onsemi

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