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AMIS42700WCGA4RH - onsemi

Description: Obsolete - Dual CAN Transceiver, High Speed, for long networks

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AMIS42700WCGA4RH - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 20 W CASE 751AQ−01 ISSUE O
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3D Models
AMIS42700WCGA4RH - onsemi  - 3D model - Small Outline Packages - SOIC 20 W CASE 751AQ−01 ISSUE O
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AMIS42700WCGA4RH Details

  • Manufacturer Part Number:

    AMIS42700WCGA4RH

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-20 Wide Body

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    751AQ

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.7762 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of Transceivers:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6416 mm

  • Supply Current-Max:

    0.1375 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5184 mm

AMIS42700WCGA4RH Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s. Use a solder with a melting point above 217°C.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent electrostatic discharge damage.
  • Use a low-impedance connection for the output pins, and a high-impedance connection for the input pins. Ensure that the device is connected to a stable power supply and a low-ESR capacitor for decoupling.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

AMIS42700WCGA4RH Overview

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Part Image AMIS42700WCGA4H onsemi

Interface Circuit, 2-Trnsvr, PDSO20