AOD21357 footprint, schematic symbol and 3D model by AO semi

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PCB Footprints

AOD21357 - AO semi PCB footprint - Other - Other - TO252(Thickness=2.4mm)

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Part Number AOD21357
Manufacturer AO semi
Pin Count 3
Part Category MOSFET (P-Channel)
Package Category Other
Footprint Name Other - TO252(Thickness=2.4mm)
Released Date May 12, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

AOD21357 Details

Manufacturer Part Number:
AOD21357
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
DPAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Date Of Intro:
2019-01-03
Manufacturer:
Alpha & Omega Semiconductor
YTEOL:
5.3
Avalanche Energy Rating (Eas):
76 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
70 A
Drain-source On Resistance-Max:
0.008 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
365 pF
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
P-CHANNEL
Power Dissipation-Max (Abs):
78 W
Pulsed Drain Current-Max (IDM):
180 A
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

AOD21357 Frequently Asked Questions (FAQs)

The maximum junction temperature of the AOD21357 is 150°C. However, it's recommended to keep the junction temperature below 125°C for reliable operation.
To ensure proper biasing, make sure to provide a stable input voltage within the recommended range (typically 4.5V to 5.5V), and ensure the input voltage is well-regulated to minimize noise and ripple.
For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and ensure good thermal conductivity between the device and the PCB. Use thermal vias and a heat sink if possible. Keep the device away from heat sources and ensure good airflow.
Use a voltage regulator or a voltage limiter to prevent overvoltage conditions. Implement overcurrent protection using a fuse or a current limiter. Ensure the PCB design includes adequate clearance and creepage distances to prevent electrical overstress.
Use ESD-sensitive handling procedures during assembly and storage. Implement ESD protection devices such as TVS diodes or ESD arrays on the PCB. Ensure the PCB design includes adequate ESD protection for the device's pins.

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