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AP21410FM-7 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution 0.5A SGL Ch USB 2.0 Curr Limited Switch

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AP21410FM-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
AP21410FM-7 - Diodes Incorporated PCB footprint - Small Outline No-lead - Small Outline No-lead - U-DFN2018-6
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3D Models
AP21410FM-7 - Diodes Incorporated - 3D model - Small Outline No-lead - U-DFN2018-6
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AP21410FM-7 Details

  • Manufacturer Part Number:

    AP21410FM-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Built-in Protections:

    OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    X-PDSO-N6

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SON

  • Package Shape:

    UNSPECIFIED

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

AP21410FM-7 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended to be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The device is sensitive to temperature and humidity. Ensure that the PCB is baked at 125°C for 24 hours before soldering, and use a soldering iron with a temperature below 260°C.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling, placed as close to the VIN pin as possible.
  • Ensure that the device is not exposed to voltage exceeding the maximum rating. Use a TVS diode or a zener diode to clamp the voltage and prevent EOS damage.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for output filtering, placed as close to the VOUT pin as possible.

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