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AP6502ASP-13 - Diodes Incorporated

Description: DiodesZetex AP6502ASP-13, PWM Current Mode Controller, 2 A, 260 kHz, 4.75 → 23 V, 8-Pin SOIC

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PCB Footprints
AP6502ASP-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8EP (SOP-8L-EP)
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AP6502ASP-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8EP (SOP-8L-EP)
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AP6502ASP-13 Details

  • Manufacturer Part Number:

    AP6502ASP-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    23 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    20 V

  • Output Voltage-Min:

    0.925 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    260 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AP6502ASP-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the output pin. Additionally, using a low ESR capacitor can help to improve the stability of the output voltage.
  • Although the datasheet specifies a maximum input voltage of 18V, it's recommended to limit the input voltage to 15V to ensure reliable operation and to prevent damage to the device.
  • To protect the AP6502ASP-13 from overcurrent conditions, it's recommended to add an external current limiting resistor or a fuse in series with the input voltage. Additionally, the device has a built-in overcurrent protection feature that will limit the output current to 2.5A.
  • A 1uF to 10uF ceramic capacitor is recommended for the input capacitor. The capacitor should be placed close to the input pin and should have a low ESR to ensure stable operation.

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