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AP66200FVBW-13 - Diodes Incorporated

Description: Conv DC-DC 3.8V to 60V Synchronous Step Down Single-Out 0.8V to 50V 2A 16-Pin UQFN EP T/R

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PCB Footprints
AP66200FVBW-13 - Diodes Incorporated PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - U-QFN4040-16/SWP
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AP66200FVBW-13 - Diodes Incorporated  - 3D model - Quad Flat No-Lead - U-QFN4040-16/SWP
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AP66200FVBW-13 Details

  • Manufacturer Part Number:

    AP66200FVBW-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • Additional Feature:

    PFM CONTROL TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    48 V

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    50 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.63 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2800 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

AP66200FVBW-13 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
  • The recommended input capacitor value is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) type, such as X5R or X7R ceramic capacitors. This ensures stable operation and minimizes input voltage ripple.
  • To troubleshoot output voltage instability or oscillation issues, check the PCB layout for any noise or signal coupling issues. Ensure that the output capacitor is properly sized and has a low ESR. Also, verify that the feedback loop is properly compensated and the device is operated within its recommended operating conditions.
  • The recommended output capacitor value is 10uF to 47uF, with a low ESR type, such as X5R or X7R ceramic capacitors. This ensures stable output voltage and minimizes output voltage ripple.

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AP66200FVBW-13 Overview

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