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AP7167-SPG-13 - Diodes Incorporated

Description: • Wide input voltage range: 2.2V – 5.5V • 230mV very low dropout at 500mA load • 500mV very low dropout at 1A load • 3% total accuracy over line, load and temperature • Very low quiescent current (IQ): 125µA typical • Adjustable output voltage range: 0.8V to 5.0V • Very fast transient response • High PSRR • Accurate voltage regulation • Current limiting and short circuit protection • Thermal shutdown protection • Stable with any type output capacitor ≥ 4.7µF • Ambient temperature range -40ºC to

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AP7167-SPG-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SOP
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AP7167-SPG-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SOP
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AP7167-SPG-13 Details

  • Manufacturer Part Number:

    AP7167-SPG-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.8 V

  • Dropout Voltage1-Nom:

    0.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Load Regulation-Max(%):

    1.5%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    5 V

  • Output Voltage1-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

AP7167-SPG-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, and make sure the input voltage is within the specified range. Also, ensure that the EN pin is properly biased to enable the device.
  • Handle the device by the body, avoid touching the pins, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the leads, and use a soldering iron with a temperature-controlled tip to prevent overheating.
  • To troubleshoot issues, start by checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, to minimize EMI/EMC issues, use a good PCB layout with proper grounding, decoupling, and shielding. Ensure that the device is placed away from noise sources, and use filters or chokes to reduce noise coupling. Follow the recommended layout and design guidelines in the datasheet and application notes.

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AP7167-SPG-13 Overview

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