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APARM2508S-SG3L5 - ABRACON

Description: 1.176GHz, 1.561GHz, 1.575GHz, 1.577GHz, 1.602GHz Beidou, Galileo, GLONASS, GPS Ceramic Patch RF Antenna 1.164GHz ~ 1.188GHz, 1.559GHz ~ 1.563GHz, 1.563GHz ~ 1.576GHz, 1.574GHz ~ 1.591GHz, 1.597GHz ~ 1.607GHz 0.5dBi, 2.4dBi, 0.6dBi, 0.6dBi, 3.4dBi Pin Surface Mount

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APARM2508S-SG3L5 - ABRACON - PCB symbol
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PCB Footprints
APARM2508S-SG3L5 - ABRACON PCB footprint - Other - Other - APARM2508S-SG3L5-1
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3D Models
APARM2508S-SG3L5 - ABRACON - 3D model - Other - APARM2508S-SG3L5-1
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APARM2508S-SG3L5 Details

  • Manufacturer Part Number:

    APARM2508S-SG3L5

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7

  • Additional Feature:

    IT CAN ALSO OPERATE AT 1572, 1561.098, 1575.42, 1577, 1602 MHZ

  • Application:

    BEIDOU/IOT/GALILEO/GLONASS/GPS

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    1

  • Omnidirectional:

    NO

  • Operating Frequency-Max:

    1177 MHz

  • Operating Frequency-Min:

    1171 MHz

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Polarization:

    RHCP

  • RF/Microwave Device Type:

    GPS ANTENNA

  • Surface Mount:

    NO

  • VSWR-Max:

    1.8

APARM2508S-SG3L5 Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a minimum pad size of 0.5mm x 0.5mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
  • The APARM2508S-SG3L5 is a moisture-sensitive device. It's recommended to store it in a dry environment (< 30% RH) and follow the MSL (Moisture Sensitivity Level) guidelines for handling and baking before reflow soldering.
  • The APARM2508S-SG3L5 can operate safely within a temperature range of -40°C to +85°C. However, it's recommended to derate the device's performance and consider thermal management strategies for high-temperature applications.
  • The APARM2508S-SG3L5 is designed to withstand moderate vibration levels. However, for high-vibration applications, it's recommended to consider additional mechanical support or mounting options to ensure the device's reliability and performance.
  • Abracon recommends a soldering profile with a peak temperature of 260°C ± 5°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 3-6°C/s to ensure reliable solder joints and minimize thermal stress.

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APARM2508S-SG3L5 Overview

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