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APS6404L-3SQRX-SN - apmemory

Description: 50Ω Output Drive Strength LVCMOS 1K Byte Wrapped Burst as long as tCEM is met Software Reset Ultra Low Power HalfsleepTM Mode with data retention

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APS6404L-3SQRX-SN - apmemory PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8L
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APS6404L-3SQRX-SN - apmemory  - 3D model - Small Outline Packages - SOP-8L
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APS6404L-3SQRX-SN Details

  • Manufacturer Part Number:

    APS6404L-3SQRX-SN

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    SOP-8

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    AP Memory

  • Clock Frequency-Max (fCLK):

    133 MHz

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    835584 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.00025 A

  • Supply Current-Max:

    0.007 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

APS6404L-3SQRX-SN Frequently Asked Questions (FAQs)

  • AP Memory recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's recommended to use a 50-ohm impedance-controlled trace for the clock signal.
  • AP Memory recommends using a thermal pad or a heat sink to dissipate heat. The device's junction temperature should be kept below 125°C. It's also recommended to use a thermal interface material (TIM) to improve heat transfer.
  • The maximum operating frequency of APS6404L-3SQRX-SN is 166.67 MHz, but it can be overclocked to 200 MHz with careful PCB design and thermal management.
  • The APS6404L-3SQRX-SN can be programmed using a serial interface, such as SPI or I2C. AP Memory provides a programming guide and software tools to assist with the programming process.
  • The power consumption of APS6404L-3SQRX-SN varies depending on the operating frequency and mode. Typically, it consumes around 1.2W at 166.67 MHz, but this can be reduced to around 0.5W in low-power mode.

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APS6404L-3SQRX-SN Overview

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