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APS6404L-SQRHX-SN - AP Memory

Description: DRAM 64Mb QSPI PSRAM Sync Serial x1/x4 SDR

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APS6404L-SQRHX-SN - AP Memory PCB footprint - Small Outline Packages - Small Outline Packages - SOP-8L(150), package code SN
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APS6404L-SQRHX-SN - AP Memory  - 3D model - Small Outline Packages - SOP-8L(150), package code SN
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APS6404L-SQRHX-SN Details

  • Manufacturer Part Number:

    APS6404L-SQRHX-SN

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    SOP-8

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    AP Memory

  • Clock Frequency-Max (fCLK):

    84 MHz

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX8

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.0003 A

  • Standby Voltage-Min:

    1.62 V

  • Supply Current-Max:

    0.007 mA

  • Supply Voltage-Max (Vsup):

    1.98 V

  • Supply Voltage-Min (Vsup):

    1.62 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

APS6404L-SQRHX-SN Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for APS6404L-SQRHX-SN is -40°C to 85°C, but it can also operate in an extended temperature range of -40°C to 125°C with reduced performance and reliability.
  • To ensure reliable data retention, it is recommended to follow the datasheet guidelines for programming and erasing cycles, and to avoid exposing the device to extreme temperatures, voltage, or radiation. Additionally, implementing error correction mechanisms and periodic data refresh can help maintain data integrity.
  • While APS6404L-SQRHX-SN is a high-quality device, it is essential to evaluate its suitability for high-reliability or safety-critical applications. AP Memory provides additional documentation and support for such applications, including failure-in-time (FIT) rates, mean time between failures (MTBF), and other reliability metrics. Consult with AP Memory's technical support team for more information.
  • APS6404L-SQRHX-SN has an internal power-on reset (POR) circuit that ensures the device is in a known state after power-up. For brown-out detection, it is recommended to use an external voltage supervisor or a dedicated brown-out detection circuit to ensure the device operates within its specified voltage range.
  • When designing a PCB with APS6404L-SQRHX-SN, it is essential to follow good layout practices, such as minimizing signal trace lengths, using decoupling capacitors, and ensuring adequate power and ground plane distribution. AP Memory provides a reference layout and design guidelines in the datasheet and application notes.

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APS6404L-SQRHX-SN Overview

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