APS6408L-OBMX-BA - AP Memory

APS6408L-OBMX-BA Details

• Manufacturer Part Number:

  APS6408L-OBMX-BA

• Part Life Cycle Code:

  Contact Manufacturer

• Package Description:

  BGA-24

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Manufacturer:

  AP Memory

• Clock Frequency-Max (fCLK):

  200 MHz

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B24

• Length:

  8 mm

• Memory Density:

  67108864 bit

• Memory IC Type:

  PSEUDO STATIC RAM

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  24

• Number of Words:

  8388608 words

• Number of Words Code:

  8000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  8MX8

• Output Enable:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA24,5X5,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Parallel/Serial:

  SERIAL

• Seated Height-Max:

  1.2 mm

• Standby Current-Max:

  0.0003 A

• Standby Voltage-Min:

  1.68 V

• Supply Current-Max:

  0.022 mA

• Supply Voltage-Max (Vsup):

  1.98 V

• Supply Voltage-Min (Vsup):

  1.68 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  6 mm