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APT100S20LCTG - Microsemi Corporation

Description: Schottky Diodes & Rectifiers FG, SCHOTTKY, 200V, TO-264, RoHS

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APT100S20LCTG - Microsemi Corporation - PCB symbol
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PCB Footprints
APT100S20LCTG - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (L) Package
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APT100S20LCTG - Microsemi Corporation - 3D model - Transistor Outline, Vertical - TO-264 (L) Package
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APT100S20LCTG Details

  • Manufacturer Part Number:

    APT100S20LCTG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-264AA

  • Package Description:

    TO-264, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT, LOW NOISE, SNUBBER DIODE

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e1

  • Non-rep Pk Forward Current-Max:

    1000 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    120 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.07 µs

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

APT100S20LCTG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots. Monitor junction temperature and adjust the system design accordingly.
  • The APT100S20LCTG has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded.
  • The APT100S20LCTG is not specifically designed for radiation-hardened applications. However, Microsemi Corporation offers radiation-hardened versions of similar products. Contact Microsemi for more information on their radiation-hardened product offerings.
  • Use a soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. Ensure that the PCB is designed to withstand the soldering process.

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APT100S20LCTG Overview

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APT100S20LCTG Alternates

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Part Image APT100S20LCTG Microchip Technology Inc

Rectifier Diode, Schottky, 1 Phase, 2 Element, 120A, 200V V(RRM), Silicon, TO-264AA
Part Image APT100S20LCTE3 Microsemi Corporation (now Microchip)

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