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APT2X60D120J - Microsemi Corporation

Description: Discrete Semiconductor Modules FG, FRED, 1200V, 60A, SOT-227

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APT2X60D120J - Microsemi Corporation PCB footprint - Other - Other - APT2X60D120J
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APT2X60D120J Details

  • Manufacturer Part Number:

    APT2X60D120J

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    ISOTOP

  • Package Description:

    ISOTOP-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    ISOTOP

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, LOW NOISE, SNUBBER DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.5 V

  • JESD-30 Code:

    R-PUFM-X4

  • JESD-609 Code:

    e1

  • Non-rep Pk Forward Current-Max:

    540 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    53 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    250 µA

  • Reverse Recovery Time-Max:

    0.4 µs

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

APT2X60D120J Frequently Asked Questions (FAQs)

  • Microsemi recommends following the guidelines in the 'APT2X60D120J Thermal Management and PCB Layout' application note, which provides detailed information on thermal pad connections, heat sink attachment, and PCB layout considerations to ensure optimal performance and reliability.
  • To ensure EMC and EMI compliance, follow the guidelines in the 'APT2X60D120J Electromagnetic Compatibility' application note, which provides recommendations on PCB layout, component selection, and shielding techniques to minimize electromagnetic radiation and susceptibility.
  • Microsemi recommends using a combination of common-mode chokes, differential-mode chokes, and capacitors to filter the input and output signals. The 'APT2X60D120J EMI Filtering' application note provides detailed guidance on filter design and component selection.
  • Microsemi recommends following a systematic troubleshooting approach, starting with a review of the power supply design, PCB layout, and component selection. The 'APT2X60D120J Troubleshooting Guide' provides a step-by-step procedure for identifying and resolving common issues.
  • The APT2X60D120J is designed to meet high-reliability standards, with a typical lifespan of 10-15 years or more, depending on operating conditions. To ensure maximum reliability, follow the recommended operating conditions, storage, and handling guidelines, and implement a robust design with adequate thermal management, EMI protection, and fault tolerance.

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APT2X60D120J Overview

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