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APT30D100BG - Microsemi Corporation

Description: Rectifiers FG, FRED, 1000V, TO-247, RoHS

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PCB Footprints
APT30D100BG - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - APT30D100BG
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3D Models
APT30D100BG - Microsemi Corporation  - 3D model - Transistor Outline, Vertical - APT30D100BG
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APT30D100BG Details

  • Manufacturer Part Number:

    APT30D100BG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-247

  • Package Description:

    ROHS COMPLIANT PACKAGE-2

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT, LOW NOISE, SNUBBER DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.3 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e1

  • Non-rep Pk Forward Current-Max:

    210 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.29 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

APT30D100BG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, a heat sink can be used to improve thermal performance.
  • The APT30D100BG has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures to prevent damage. A minimum of 10 kΩ resistance and 100 pF capacitance is recommended for ESD protection.
  • Yes, the APT30D100BG is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is recommended to follow the recommended operating conditions and derating guidelines to ensure reliable operation.
  • To troubleshoot issues with the APT30D100BG, it is recommended to check the power supply voltage, input current, and output voltage. Also, check for any signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for more information.

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APT30D100BG Overview

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