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AQHV12-01ETG-C - LITTELFUSE

Description: 1Ch 200W 12V Bidirectional esd Diode 30pF @ 1MHz -40°C ~ 150°C 13.3V

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Symbol
AQHV12-01ETG-C - LITTELFUSE - PCB symbol
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PCB Footprints
AQHV12-01ETG-C - LITTELFUSE PCB footprint - Other - Other - SOD882-2025-2
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3D Models
AQHV12-01ETG-C - LITTELFUSE - 3D model - Other - SOD882-2025-2
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AQHV12-01ETG-C Details

  • Manufacturer Part Number:

    AQHV12-01ETG-C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5.97

  • Breakdown Voltage-Min:

    13.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    MO-236

  • JESD-30 Code:

    R-PBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    200 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

AQHV12-01ETG-C Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for AQHV12-01ETG-C is a rectangular pad with dimensions of 3.5mm x 2.5mm, with a 1.5mm diameter hole in the center for the thermal tab.
  • While AQHV12-01ETG-C is rated for operation up to 150°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • Store AQHV12-01ETG-C in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, with a relative humidity of 60% or less.
  • While AQHV12-01ETG-C is designed to withstand some vibration, it's essential to consider the specific vibration profile and ensure the component is properly secured to the PCB to prevent damage or dislodging.

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AQHV12-01ETG-C Overview

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