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AR0134CSSM00SUEA0-TRBR - onsemi

Description: Obsolete - CMOS Image Sensor, Digital, Global Shutter, 1.2 MP, 1/3"

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AR0134CSSM00SUEA0-TRBR - onsemi PCB footprint - BGA - BGA - IBGA63 9x9 CASE 503AG ISSUE C
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AR0134CSSM00SUEA0-TRBR - onsemi  - 3D model - BGA - IBGA63 9x9 CASE 503AG ISSUE C
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AR0134CSSM00SUEA0-TRBR Details

  • Manufacturer Part Number:

    AR0134CSSM00SUEA0-TRBR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    IBGA-63

  • Package Description:

    9 X 9 MM, IBGA-63

  • Manufacturer Package Code:

    503AG

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ELECTRONIC ROLLING SHUTTER, IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1V

  • Array Type:

    SINGLE FRAME

  • Body Breadth:

    9 mm

  • Body Height:

    1.4 mm

  • Body Length or Diameter:

    9 mm

  • Data Rate:

    700 Mbps

  • Dynamic Range:

    64 dB

  • Frame Rate:

    60 fps

  • Horizontal Pixel:

    1280

  • JESD-609 Code:

    e1

  • Master Clock:

    50 MHz

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Current-Max:

    60 mA

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -30 °C

  • Optical Format:

    1/3 inch

  • Output Interface Type:

    2-WIRE INTERFACE

  • Output Range:

    -22-22mA

  • Output Type:

    DIGITAL CURRENT

  • Package Shape/Style:

    SQUARE

  • Pixel Size:

    3.75 µm

  • Sensors/Transducers Type:

    IMAGE SENSOR,CMOS

  • Spectral Response (nm):

    350-1100

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    960

AR0134CSSM00SUEA0-TRBR Frequently Asked Questions (FAQs)

  • Onsemi provides a recommended PCB layout and thermal management guide in their application note AND9313/D, which includes guidelines for thermal pad connection, PCB layer stackup, and heat sink design.
  • To optimize the AR0134CSSM00SUEA0-TRBR's performance in low-light conditions, adjust the exposure time, gain, and black level correction. Additionally, consider using a lens with a higher F-number, increasing the sensor's analog gain, and implementing noise reduction algorithms in the image processing pipeline.
  • The maximum clock frequency for the AR0134CSSM00SUEA0-TRBR's MIPI interface is 1.5 Gbps per lane, which translates to a maximum data transfer rate of 12 Gbps for a 4-lane MIPI configuration.
  • To minimize the impact of EMI on the AR0134CSSM00SUEA0-TRBR's image quality, use proper shielding, grounding, and decoupling techniques in the PCB design. Additionally, consider using EMI filters and shielding materials in the camera module's mechanical design.
  • The AR0134CSSM00SUEA0-TRBR's power consumption varies depending on the operating mode. In typical operating conditions, the power consumption is around 250 mW. However, in standby mode, the power consumption can be as low as 10 mW. Refer to the datasheet for more detailed power consumption information.

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AR0134CSSM00SUEA0-TRBR Overview

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