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AR8033-AL1A-R - Qualcomm

Description: PHY 3-CH 10Mbps/100Mbps/1Gbps 1.1V/2.62V/3.3V 48-Pin QFN EP T/R

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PCB Footprints
AR8033-AL1A-R - Qualcomm PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-pin 6 × 6 mm QFN(Height=0.8mm)
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3D Models
AR8033-AL1A-R - Qualcomm  - 3D model - Quad Flat No-Lead - 48-pin 6 × 6 mm QFN(Height=0.8mm)
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AR8033-AL1A-R Details

  • Manufacturer Part Number:

    AR8033-AL1A-R

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    QFN-48

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Qualcomm

  • YTEOL:

    2

  • Data Rate:

    1000000 Mbps

  • JESD-30 Code:

    S-XQCC-N48

  • Length:

    6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    IEEE 802.3/802.3U/802.3ab/802.3az

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    113.7 mA

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

AR8033-AL1A-R Frequently Asked Questions (FAQs)

  • Qualcomm provides a recommended PCB layout guide for the AR8033-AL1A-R, which includes guidelines for component placement, routing, and thermal management. It's essential to follow this guide to ensure optimal performance and reliability.
  • To minimize power consumption, configure the AR8033-AL1A-R to use the lowest possible voltage and frequency settings. Additionally, use the device's power-saving features, such as dynamic voltage and frequency scaling, and enable low-power modes when possible.
  • The AR8033-AL1A-R has a maximum junction temperature of 125°C. Ensure good thermal conductivity between the device and the PCB, and use thermal pads or heat sinks if necessary. Keep the device away from heat sources and ensure good airflow around the PCB.
  • Use Qualcomm's debugging tools and software development kits (SDKs) to troubleshoot issues with the AR8033-AL1A-R. Check the device's registers and logs for error messages, and consult Qualcomm's documentation and support resources for guidance.
  • The AR8033-AL1A-R is designed to meet EMI and EMC standards, but proper PCB design and layout are crucial to minimize electromagnetic interference. Follow Qualcomm's guidelines for EMI and EMC compliance, and ensure proper shielding, grounding, and filtering.

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AR8033-AL1A-R Overview

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