AS6C1008-55BIN - Alliance Memory

AS6C1008-55BIN Details

• Manufacturer Part Number:

  AS6C1008-55BIN

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Pin Count:

  36

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.41

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  Alliance Memory Inc

• YTEOL:

  4

• Access Time-Max:

  55 ns

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B36

• Length:

  8 mm

• Memory Density:

  1048576 bit

• Memory IC Type:

  STANDARD SRAM

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  36

• Number of Words:

  131072 words

• Number of Words Code:

  128000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  128KX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA36,6X8,30

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Standby Current-Max:

  0.000003 A

• Standby Voltage-Min:

  1.5 V

• Supply Current-Max:

  0.06 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.75 mm

• Terminal Position:

  BOTTOM

• Width:

  6 mm