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AS6C8008-55BIN - Alliance Memory

Description: SRAM 8M, 2.7-5.5V, 55ns 1024K x 8 Asyn SRAM

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PCB Footprints
AS6C8008-55BIN - Alliance Memory PCB footprint - BGA - BGA - 48-ball TFGBA
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3D Models
AS6C8008-55BIN - Alliance Memory  - 3D model - BGA - 48-ball TFGBA
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AS6C8008-55BIN Details

  • Manufacturer Part Number:

    AS6C8008-55BIN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    4

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B48

  • Length:

    8 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA48,6X8,30

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Standby Current-Max:

    0.00005 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

AS6C8008-55BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AS6C8008-55BIN is -40°C to 85°C.
  • The power-up and power-down sequences for the AS6C8008-55BIN should be handled according to the recommended power-up and power-down sequences outlined in the datasheet to prevent damage to the device.
  • The recommended voltage range for the AS6C8008-55BIN is 4.5V to 5.5V.
  • To implement a reliable write operation for the AS6C8008-55BIN, ensure that the write enable (WE) signal is low, the output enable (OE) signal is high, and the chip select (CE) signal is low.
  • The maximum clock frequency supported by the AS6C8008-55BIN is 55 MHz.

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AS6C8008-55BIN Overview

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