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AS9F38G08SA-25BIN - Alliance Memory

Description: NAND Flash 8Gb, x8, 3.3V, SLC Parallel NAND Flash, 4bit ECC, 25ns, 63b FBGA, Industrial Grade

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PCB Footprints
AS9F38G08SA-25BIN - Alliance Memory PCB footprint - BGA - BGA - 63-ball FBGA - 9 x 11 ball array 0.8mm pitch
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3D Models
AS9F38G08SA-25BIN - Alliance Memory  - 3D model - BGA - 63-ball FBGA - 9 x 11 ball array 0.8mm pitch
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AS9F38G08SA-25BIN Details

  • Manufacturer Part Number:

    AS9F38G08SA-25BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • Memory IC Type:

    FLASH

AS9F38G08SA-25BIN Frequently Asked Questions (FAQs)

  • The AS9F38G08SA-25BIN has an operating temperature range of -40°C to 85°C.
  • Yes, the AS9F38G08SA-25BIN is lead-free and RoHS (Restriction of Hazardous Substances) compliant.
  • The typical standby current consumption of the AS9F38G08SA-25BIN is around 1.5mA.
  • Yes, the AS9F38G08SA-25BIN is compatible with 3.3V systems, but it can also operate at 2.5V and 1.8V.
  • The minimum clock frequency required for the AS9F38G08SA-25BIN is 0.01MHz.

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AS9F38G08SA-25BIN Overview

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