ASE2D-2M-10-Z footprint, schematic symbol and 3D model by Nidec Copal

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ASE2D-2M-10-Z Details

The recommended PCB layout and land pattern for ASE2D-2M-10-Z can be found in the Nidec Copal Electronics Corporation's application note or by contacting their technical support team. A general guideline is to follow the JEDEC standard for QFN packages.
Proper thermal management is crucial for the reliability of ASE2D-2M-10-Z. Ensure good thermal conductivity between the device and the PCB by using thermal vias and a thermal pad. A heat sink or a thermal interface material can also be used to improve heat dissipation.
The recommended soldering profile for ASE2D-2M-10-Z is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds. However, it's recommended to consult the Nidec Copal Electronics Corporation's application note or technical support team for specific guidance.
ASE2D-2M-10-Z is designed to withstand moderate vibration levels. However, for high-vibration environments, it's recommended to consult with Nidec Copal Electronics Corporation's technical support team to discuss specific requirements and potential customizations.
The MSL of ASE2D-2M-10-Z is typically level 3, which means it can withstand a maximum exposure of 168 hours at 30°C and 60% relative humidity. However, it's recommended to consult the datasheet or Nidec Copal Electronics Corporation's technical support team for specific guidance.

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