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ASFC32G31T3-51BIN - Alliance Memory

Description: eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

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PCB Footprints
ASFC32G31T3-51BIN - Alliance Memory PCB footprint - BGA - BGA - 153-Ball  FBGA
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3D Models
ASFC32G31T3-51BIN - Alliance Memory  - 3D model - BGA - 153-Ball  FBGA
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ASFC32G31T3-51BIN Details

  • Manufacturer Part Number:

    ASFC32G31T3-51BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • Memory IC Type:

    eMMC

ASFC32G31T3-51BIN Frequently Asked Questions (FAQs)

  • The ASFC32G31T3-51BIN has an operating temperature range of 0°C to 70°C, and an extended temperature range of -40°C to 85°C for industrial applications.
  • To enter self-refresh mode, the device must be in the idle state, and then the SREF input must be driven low. The device will then enter self-refresh mode, and the clock can be stopped. To exit self-refresh mode, the SREF input must be driven high, and the clock must be restarted.
  • The ASFC32G31T3-51BIN supports a maximum clock frequency of 166 MHz.
  • During power-up, the VDD and VDDQ pins must be powered up simultaneously, and the clock must be stable before applying any input signals. During power-down, the clock must be stopped, and the input signals must be held in a stable state before powering down the VDD and VDDQ pins.
  • The ASFC32G31T3-51BIN has a latency of 3 clock cycles (CL3).

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