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ASFC32G31T3-51BIN - Alliance Memory

Description: eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray

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Symbol

ASFC32G31T3-51BIN - Alliance Memory - PCB symbol

PCB Footprints

ASFC32G31T3-51BIN - Alliance Memory PCB footprint - BGA - BGA - 153-Ball FBGA

3D Models

ASFC32G31T3-51BIN - Alliance Memory - 3D model - BGA - 153-Ball FBGA

Datasheet Download Datasheet
Stock & Prices Price & Stock for ASFC32G31T3-51BIN
Part Number ASFC32G31T3-51BIN
Manufacturer Alliance Memory
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153-Ball FBGA
Released Date Jun 14, 2024
Last Modified Date Jun 14, 2024 8:35 AM UTC
Pinout / Pin List Click Here (Member Only)

ASFC32G31T3-51BIN Details

Manufacturer Part Number:
ASFC32G31T3-51BIN
Manufacturer:
Alliance Memory Inc

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